Dedicated wet blast equipment for semiconductor package burr removal (SLX)
Fully automatic wet blast equipment ideal for deflashing lead frames.
SLX is a wet blast device with high flexibility that accommodates a variety of package shapes and sizes. It can achieve optimal processing with wide guns and mini velocity guns, and automates the entire process from washing to drying in-line. It is ideal for deflashing IC and LED lead frames and removing resin burrs. 【Features】 - Highly flexible design that accommodates various package shapes and sizes - Equipped with wide guns and mini velocity guns for optimal blast processing - Fully automated in-line processing from blasting to washing, draining, and drying
- Company:マコー
- Price:10 million yen-50 million yen